Kaisi K-11 Special Clamp for iPhone 11 Phone Motherboard
Support motherboard maintenance, chip removal, CPU, IC glue removal, etc.
TBK
Support multiple mobile phone specifications.
₹6,089
Price including GST
Available to order
Quantity
Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch. Review your order details in the cart.
Delivery
Free on orders above ₹999. Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch.
Returns & warranty
Support multiple mobile phone specifications
As supplied by the manufacturer, including packaging.
Shipping: Free delivery on orders above ₹999. Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch. You can track progress from your account.
Returns: To start a return or refund on this order, see our returns policy or contact support with your order number.
Warranty: Warranty coverage varies by product and is confirmed in the order documentation. See our warranty policy or contact support before making a claim.
Support motherboard maintenance, chip removal, CPU, IC glue removal, etc.
For Disassemble PCB Chips/Mobile Phone Frame.
Stencils wont deform under high temperature.
Used to locate and relocate mobile phone PCB BGA parts.