Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max
Strong magnetic adsorption, simple operation.
Kaisi
Support motherboard maintenance, chip removal, CPU, IC glue removal, etc.
₹5,680
Price including GST
Available to order
Quantity
Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch. Review your order details in the cart.
Delivery
Free on orders above ₹999. Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch.
Returns & warranty
Support motherboard maintenance, chip removal, CPU, IC glue removal, etc
As supplied by the manufacturer, including packaging.
Shipping: Free delivery on orders above ₹999. Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch. You can track progress from your account.
Returns: To start a return or refund on this order, see our returns policy or contact support with your order number.
Warranty: Warranty coverage varies by product and is confirmed in the order documentation. See our warranty policy or contact support before making a claim.
Strong magnetic adsorption, simple operation.
Used to locate and relocate mobile phone PCB BGA parts.
Support multiple mobile phone specifications.
For Disassemble PCB Chips/Mobile Phone Frame.