Findx F11-mini For iPhone 11 / 11 Pro / 11 Pro Max Reballing Stencil Platform Jig Fixture
Used to locate and relocate mobile phone PCB BGA parts.
MECHANIC
High temperature and fast heat dissipation design.
₹11,760
Price including GST
Available to order
Quantity
Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch. Review your order details in the cart.
Delivery
Free on orders above ₹999. Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch.
Returns & warranty
High temperature and fast heat dissipation design
As supplied by the manufacturer, including packaging.
Shipping: Free delivery on orders above ₹999. Dispatch within 1–2 business days. Delivery is expected 3–7 business days after dispatch. You can track progress from your account.
Returns: To start a return or refund on this order, see our returns policy or contact support with your order number.
Warranty: Warranty coverage varies by product and is confirmed in the order documentation. See our warranty policy or contact support before making a claim.
Used to locate and relocate mobile phone PCB BGA parts.
It can soften the adhesive surface quickly so that can separate the screen more safe and convenient.
Precise positioning.
Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation.